Rumor

Micron's HBM3E and HBM4 reportedly fully contracted through Calendar Year 2026

Thursday, November 27, 2025 at 11:31 PM

Micron (MU) has reportedly stated that its High-Bandwidth Memory (HBM) products, including HBM3E and the upcoming HBM4, are now completely sold out under contract through the entirety of calendar year 2026 (C26). This significant demand indication for future HBM capacity suggests a robust outlook for the high-end memory market.

Context

In a significant market update, Micron announced in November 2025 that its entire supply of high-demand HBM3E and next-generation HBM4 memory is now fully contracted through calendar year 2026. This early sell-out, confirmed during a company presentation, underscores the voracious appetite for AI accelerator components from major customers like Nvidia and AMD, locking in a critical part of the supply chain more than a year in advance. The announcement signals a period of extreme supply tightness and strong pricing power for memory producers. Micron projects this tightness will extend beyond 2026, citing industry-wide limitations in manufacturing capacity to meet demand. This puts pressure on competitors Samsung and SK Hynix to meet the market's remaining needs. While Samsung is already shipping HBM4 samples with mass production slated for 2026, the industry now faces a clear supply bottleneck for the next two years.