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Micron develops 256GB LPDDR5X LPCAMM2 and starts sampling to customers

Thursday, March 5, 2026 at 09:40 AM

Micron has developed a 256GB LPDDR5X LPCAMM2 memory module and has begun shipping samples to customers. This high-density memory module is designed for energy efficiency and space savings in next-generation computing infrastructure.

Context

Memory giant Micron Technology has officially begun sampling its 256GB LPDDR5X LPCAMM2 memory modules to customers, marking a significant milestone in the evolution of laptop hardware. This new form factor, based on the JEDEC CAMM2 standard, is designed to replace the aging SO-DIMM architecture that has been the industry standard since 1997. By utilizing LPDDR5X in a modular format, Micron is bridging the gap between the high efficiency of soldered mobile memory and the upgradeability of traditional plug-in modules. The performance and efficiency gains are substantial for the next generation of AI-ready PCs. The LPCAMM2 modules offer up to 61% lower active power consumption and a 64% reduction in space compared to standard DDR5 SO-DIMMs. With data transfer speeds reaching 9,600 Mbps, these modules provide the high bandwidth necessary for local AI inference and complex workloads while significantly extending battery life. This transition allows laptop designers to create thinner, lighter devices without sacrificing the ability to service or upgrade system memory.

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