Rumor

Asahi Kasei's PIMEL™ Photosensitive Polyimide Capacity Now Operational

Saturday, November 29, 2025 at 01:36 AM

The tweet is likely referring to the operational status of Asahi Kasei's new PIMEL™ photosensitive polyimide (PSPI) plant in Fuji City, which was completed in December 2024 to support increasing demand for advanced semiconductor packaging materials. The PIMEL™ PSPI is a key material used for buffer coatings and passivation layers in semiconductor applications.

Context

Surging demand for AI accelerators is fueling a massive expansion in advanced packaging capacity. Foundry giant TSMC is on track to nearly double its CoWoS (Chip-on-Wafer-on-Substrate) output, targeting a record 75,000 wafers per month in 2025. This aggressive build-out is essential to alleviate the primary bottleneck for producing next-generation AI chips and is driven by unrelenting demand from major customers. The expansion is reportedly on track, with new facilities contributing to the increased output throughout 2025. This capacity surge creates a significant tailwind for key material suppliers like Asahi Kasei, whose PIMEL photosensitive polyimide is a critical dielectric material for CoWoS packaging. Asahi Kasei has confirmed that demand from the AI sector is rising "far more quickly than initially expected." In response, the company brought a new production plant online in December 2024 to meet escalating orders. The company's strategic importance was recently validated when it received a 2024 TSMC Excellent Performance Award for its technology collaboration in advanced packaging.

Related Companies

Hua Hong Semiconductor
Hua Hong Semiconductor
1347
CN