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Gigaphoton supplies KrF excimer laser source to ORC Manufacturing.
Monday, December 8, 2025 at 10:40 AM
Gigaphoton has delivered a KrF excimer laser light source, which is specialized for use in advanced semiconductor packaging processes, to ORC Manufacturing.
Context
In a significant development for the semiconductor advanced packaging industry, Gigaphoton has successfully delivered and installed its G300K KrF excimer laser to ORC Manufacturing Co., Ltd. The installation was completed in November 2025, marking a crucial step in enhancing ultra-fine ablation processing capabilities. This 248 nm wavelength laser is specifically designed for creating micro-via holes of 10 µm or less and trenches, essential for advanced packaging technologies.
The G300K has been integrated into ORC Manufacturing's processing equipment, representing its first application in the semiconductor package substrate industry. This technology is vital for the manufacturing of 2.5D/3D packages utilizing chiplets, which are increasingly critical for AI chipsets. The processing results and relevant outputs from this collaboration are slated to be showcased at SEMICON Japan 2025, starting on December 17, 2025.
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