News
Chinese memory makers and equipment firms localize supply chain for HBM mass production
Friday, January 16, 2026 at 09:24 AM
Chinese memory manufacturers CXMT and YMTC are moving toward HBM mass production while localizing the supply chain for essential specialized equipment. Domestic firms like NAURA Technology, ACM Research, and U-Precision are developing tools for etching, deposition, and hybrid bonding to bypass U.S. export controls on advanced packaging and TSV technology. CXMT aims to produce HBM3 samples this year for domestic AI chipmakers like Huawei.
Context
Chinese memory leaders CXMT and YMTC are accelerating the localization of High Bandwidth Memory (HBM) production to bypass tightening U.S. export restrictions. CXMT aims to mass-produce fourth-generation HBM3 this year, providing a critical domestic alternative for AI giants like Huawei. This shift is a direct response to a global market currently dominated by SK Hynix, Samsung Electronics, and Micron, whose advanced chips remain subject to international trade curbs.
To secure this supply chain, domestic equipment giants NAURA Technology, ACM Research, and U-Precision are rapidly developing specialized tools for etching, thinning, and advanced packaging. NAURA already commands over 30% of China’s etching market and is expanding into HBM-specific deposition and cleaning systems. By mastering through-silicon via (TSV) and hybrid bonding technologies, these firms aim to eliminate reliance on foreign hardware, ensuring the survival of China's domestic AI semiconductor ecosystem throughout 2024 and beyond.
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