Rumor

Tesla reportedly chose Samsung Foundry for AI6 front-end and Intel IFS for back-end packaging on its Dojo system.

Friday, December 12, 2025 at 09:28 AM

Supply chain checks suggest that some fabless companies are increasingly dissatisfied with TSMC's PPA improvements relative to high price increases. The tweet claims that Tesla has already moved to adopt a model using Samsung Foundry for the front-end production of its AI6 chips and Intel IFS for the back-end packaging in the integrated Dojo system.

Context

Tesla is reportedly adopting a new supply chain strategy for its next-generation Dojo 3 supercomputer, selecting Samsung Foundry to fabricate its AI6 chips, expected to be a 2 nm class device. For module-level back-end integration, Intel Foundry/IFS will provide services, leveraging its EMIB technology. This move signals a significant diversification in the high-performance AI chip manufacturing landscape. This strategic decision is largely attributed to growing capacity constraints and pricing concerns with TSMC's front-end and advanced packaging. The "Samsung front-end + Intel back-end" model could emerge as a viable alternative for other fabless companies. Samsung reportedly secured a substantial ₩22.76 trillion consignment manufacturing contract. The ramp-up for Dojo/AI6 is anticipated across 2026–2028, with mass-scale targets for AI6 around mid-2028.