Rumor

Nvidia advances CoWoP technology with concentrated supply chain of three PCB manufacturers

Tuesday, March 10, 2026 at 03:15 AM

Nvidia is reportedly moving forward with its CoWoP (Chip on Wafer on Package) advanced packaging technology, which has narrowed the qualified printed circuit board (PCB) supply chain to only three specific manufacturers.

Context

Nvidia is reportedly advancing its CoWoP (Chip-on-Wafer-on-Platform) technology, a revolutionary packaging architecture that mounts chips directly onto PCB platforms. This shift effectively eliminates the traditional ABF (Ajinomoto Build-up Film) substrate, a persistent supply chain bottleneck that currently lacks a domestic U.S. manufacturing source. By bypassing the IC substrate, Nvidia aims to reduce costs, improve thermal management, and shorten delivery times for next-generation AI accelerators. The supply chain for this specialized technology has narrowed to just three PCB manufacturers capable of meeting the extreme density and reliability requirements of CoWoP. This concentration highlights a strategic consolidation as the industry moves away from standard CoWoS packaging. While some analysts remain skeptical about near-term adoption for chips like Rubin Ultra, the push toward mSAP and HDI processes on large-scale PCBs represents a significant pivot in the AI hardware value chain through 2026.

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