Nvidia is rumored to outsource I/O die production and advanced packaging for 25% of its next-gen Feynman GPUs to Intel Foundry in 2028, potentially using Intel 18A or 14A for I/O dies and EMIB packaging. TSMC would continue to produce all GPU dies and provide CoWoS packaging for the remaining 75%. The report also mentions Intel Foundry producing entry-level Apple M-series chips.