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Epson and Manz Asia collaborate to innovate semiconductor manufacturing using inkjet technology

Thursday, March 12, 2026 at 10:12 AM

Epson is partnering with Manz Asia to develop next-generation semiconductor manufacturing processes that leverage Epson's precision inkjet printhead technology. The collaboration aims to innovate semiconductor production through high-accuracy liquid deposition methods.

Context

On March 12, 2026, Seiko Epson Corporation and Manz Asia announced a strategic partnership to integrate high-precision inkjet technology into semiconductor manufacturing. The collaboration combines Epson's proprietary PrecisionCore printhead technology with Manz Asia's expertise in advanced packaging equipment. This initiative aims to replace traditional lithography steps with maskless, digital deposition for critical components like 2.5D/3D antenna traces, heatsinks, and bonding layers in RFIC, PMIC, and Co-Packaged Optics (CPO) applications. This partnership is significant for the semiconductor supply chain as it targets a "Lab-to-Fab" transition, providing scalable equipment that ranges from R&D to high-volume mass production. By utilizing MEMS-based inkjet fabrication, the companies aim to reduce material waste and simplify the production of complex, three-dimensional semiconductor structures. The move reflects a broader industry shift toward heterogeneous integration and advanced packaging solutions to sustain performance gains as traditional transistor scaling reaches its physical limits.

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