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Towa to establish new semiconductor manufacturing equipment R&D center in Kyoto
Tuesday, December 23, 2025 at 12:40 AM
Towa is establishing a new facility in Kyoto Prefecture dedicated to the development of new semiconductor manufacturing equipment and related technologies.
Context
Towa Corporation announced on December 22, 2025, the acquisition of approximately 24,420 square meters of land in Keihanna Science City, Kyoto, to establish a new R&D and human resource development hub. This facility will focus on advancing next-generation packaging solutions, specifically Mold Underfill (MUF) technologies essential for high-performance AI chips and High Bandwidth Memory (HBM). The strategic expansion is designed to solidify the company’s dominant position in the semiconductor back-end process as global demand for AI-driven hardware escalates.
The project is a cornerstone of the TOWA Vision 2032 strategy, which targets annual sales of 100 billion yen and a 25% operating profit margin. Beyond equipment R&D, the site will support the TOWA Academy, a talent development initiative launching in April 2025 to ensure the transfer of core technical expertise. By centralizing innovation in Kyoto, Towa Corporation aims to accelerate product cycles and maintain its global leadership in specialized molding equipment for the evolving semiconductor supply chain.
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