Changkuang (7795) capitalizes on surging ABF and advanced packaging demand for AI and HPC, with new glass substrate and PLP equipment

Changkuang (7795) recently listed on the stock exchange, leveraging its strong position in high-end ABF substrate vacuum laminators for semiconductor packaging. The company is actively investing in next-generation equipment, including glass substrates and panel-level chip packaging, driven by the increasing demand for AI and HPC. Changkuang has successfully developed vacuum lamination equipment for glass substrates and delivered test equipment to a major US IDM, receiving positive feedback on yield rates. The company is also developing bonding equipment for thin glass substrates and vacuum laminators for PLP systems, with ongoing testing in collaboration with Japanese and Taiwanese partners. Changkuang is expanding globally, monitoring overseas investments by substrate customers and strengthening local service capabilities in response to localization policies in the US, Europe, and Japan. The company emphasizes R&D collaboration between Taiwan and Japan, leveraging its parent company Changxing Materials and Japanese subsidiary Nikko Materials. Additionally, Changkuang is integrating smart manufacturing and equipment digitalization with AI models for yield prediction and offers an "equipment + service" business model. Strategic shareholders, including Changxing Materials, Wanrun Technology, and Innolux Development, further strengthen its vertical integration in materials, equipment, and customer ecosystems.