STMicroelectronics starts mass production of high-performance silicon photonics platform for AI infrastructure
News

STMicroelectronics starts mass production of high-performance silicon photonics platform for AI infrastructure

Monday, March 16, 2026 at 01:40 PM

STMicroelectronics has initiated mass production of its high-performance silicon photonics platform designed for AI infrastructure applications. This technology targets high-speed data transmission requirements in next-generation data centers.

Context

On March 16, 2026, STMicroelectronics announced it has entered mass production of its PIC100 silicon photonics platform at its 300 mm facility in Crolles, France. This high-volume ramp is designed to meet the explosive demand for 800G and 1.6T optical transceivers within AI data centers and hyperscale computing clusters. Developed in collaboration with Amazon Web Services (AWS), the platform addresses critical bottlenecks in AI infrastructure by providing higher bandwidth and improved energy efficiency through 200 Gbps/lane technology. The company is positioning itself to capture a significant share of the rapidly growing optical interconnect market, which analysts expect to surpass $34 billion by 2030. STMicroelectronics plans to more than quadruple its production capacity by 2027, supported by long-term reservation commitments from major customers. Furthermore, the company unveiled a roadmap for PIC100-TSV, integrating through-silicon via technology to enable next-generation co-packaged optics for even denser AI server architectures.

Related Companies

STMicroelectronics
STMicroelectronics
STM
CH