Rumor
Samsung prepares mass production of HBM4 for NVIDIA with major 1c DRAM capacity allocation
Friday, January 2, 2026 at 02:20 AM
Samsung is transitioning its 1c (10nm-class) DRAM capacity to HBM4 production, with mass production readiness for NVIDIA expected to begin in February. The company is securing capacity for approximately 130,000 wafers per month at its Pyeongtaek campus. Final quality verification tests, including environmental reliability testing with TSMC CoWoS packaging, are expected to conclude shortly, enabling potential supply by April or May.
Context
Samsung Electronics is accelerating its entry into the NVIDIA AI supply chain by allocating the vast majority of its 1c DRAM capacity to HBM4 production. The company aims to reach a production capacity of 130,000 wafers per month by the first half of 2025, prioritizing these advanced 10nm-class chips for next-generation high-bandwidth memory. With final quality verification tests expected to conclude as early as this week, Samsung Electronics is moving into a preemptive mass production phase to meet urgent volume requests from NVIDIA.
Mass production readiness is scheduled to intensify in February, with full-scale commercial supply projected to begin around April or May. This strategic shift involves close integration with TSMC's packaging technology to ensure reliability for AI accelerators. By funneling nearly all its 1c DRAM output into HBM4, Samsung Electronics signals extreme confidence in its technical yields and a clear intent to reclaim leadership in the high-performance memory market.
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