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Fujibo Holdings to invest 5.3 billion yen in CMP pad production capacity at Oita plant
Friday, January 30, 2026 at 10:15 AM
Fujibo Holdings is investing 5.3 billion yen at its Oita plant to increase production capacity for soft CMP pads used in semiconductor polishing and planarization processes.
Context
Fujibo Holdings is investing 5.3 billion yen to expand production capacity for semiconductor CMP (Chemical Mechanical Planarization) soft pads at its Oita Plant. This capital expenditure focuses on the specialized polishing materials required for the final surface-leveling stage of wafer fabrication. The expansion is a direct response to the intensifying demand for high-performance computing and AI-driven hardware, which requires increasingly precise and frequent polishing cycles during the manufacturing process.
This strategic move reinforces Fujibo Holdings' position as a key supplier in the advanced semiconductor supply chain. By scaling its domestic output, the company aims to capture a larger share of the growing logic and memory chip markets. For investors, this investment highlights the company’s pivot toward high-margin electronic materials, positioning it to benefit from the multi-year capacity upgrade cycle currently underway in global semiconductor production facilities.
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