News
Broadcom begins shipping 2nm custom SoCs with 3.5D packaging to Fujitsu
Thursday, February 26, 2026 at 02:58 PM
Broadcom has begun shipping its first 2nm process 3.5D custom SoC, with Fujitsu confirmed as the primary customer for this advanced packaging technology.
Context
Fujitsu is advancing its semiconductor roadmap by utilizing 3.5D packaging for its upcoming MONAKA processor. This sophisticated integration technique combines chiplet-based designs with high-speed interconnects to maximize data throughput while significantly reducing power consumption. Built on the Arm architecture, MONAKA is designed to succeed the technology used in the Fugaku supercomputer, specifically targeting the high-growth AI and data center markets where energy efficiency is becoming a primary competitive advantage.
The move to 3.5D packaging allows Fujitsu to achieve a dense 150-core configuration, targeting a 2x improvement in power efficiency per watt over current industry standards. Expected to utilize a 2nm manufacturing node, the processor is slated for a commercial debut in 2027. For investors, this highlights Fujitsu's push to capture market share from traditional chipmakers by offering specialized silicon that addresses the cooling and density challenges faced by modern hyper-scale cloud infrastructure.
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