Rumor
Apple and Huawei reportedly plan wide I/O memory implementation
Saturday, December 6, 2025 at 07:44 AM
Watchers claim that both Apple and Huawei are developing plans to introduce wide I/O memory technology, though implementation is not expected until around 2028 due to anticipated high costs.
Context
Both Huawei and Apple are reportedly exploring the integration of high-bandwidth memory (HBM) or low-latency wide I/O memory into their devices. This strategic move is crucial for accelerating on-device AI capabilities, promising next-generation processing speeds up to 128GB/s. This shift underscores the increasing demand for advanced memory solutions to power sophisticated AI applications directly on consumer electronics.
The broader memory market is experiencing significant growth, with HBM revenue projected to achieve a 33% CAGR between 2024 and 2030, potentially capturing 50% of the DRAM market by the decade's end. While some rumors suggest Apple could introduce HBM by 2027, industry experts are skeptical, anticipating a broader rollout closer to 2028 or later due to engineering, packaging, and cost challenges. In the short term, both companies may opt for interim solutions such as increasing RAM by 8GB and utilizing small Mixture-of-Experts (MoE) models to enhance AI performance.
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