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Micron Plans Next-Gen HBM Factory in Hiroshima with \1.5T Investment
Saturday, November 29, 2025 at 09:25 AM
Micron is set to invest \1.5 trillion in a new factory in Hiroshima, Japan, for the production of next-generation High Bandwidth Memory (HBM), with up to \500 billion in subsidies from the Japanese government. Construction is slated for May 2026, with product shipments expected around 2028.
Context
Micron Technology is set to significantly expand its role in the AI semiconductor supply chain with a planned ¥1.5 trillion (approximately $9.6 billion) investment in a new factory in Hiroshima, Japan. The facility will focus on producing next-generation High-Bandwidth Memory (HBM), a critical component for high-performance AI processors. This strategic investment is heavily supported by the Japanese government, which is providing subsidies of up to ¥500 billion to strengthen its domestic chip manufacturing capabilities.
The project aims to address the surging global demand for advanced memory driven by the AI boom. Construction on the new plant is scheduled to begin in May 2026, with the first shipments of HBM chips expected to start around 2028. This move positions Micron to more effectively challenge the market dominance of South Korean competitors like Samsung and SK Hynix in the lucrative HBM space, while aligning with Japan's national strategy to secure a stable supply of critical semiconductors.
Sources (28)
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