News
Sumitomo Chemical publishes technical guide on back-end semiconductor manufacturing processes
Sunday, February 22, 2026 at 12:48 AM
Sumitomo Chemical has released a detailed technical illustration and overview of semiconductor manufacturing processes, including specific focus on back-end (assembly and packaging) operations.
Context
Sumitomo Chemical has released a comprehensive technical guide detailing back-end semiconductor manufacturing, signaling a strategic pivot to capture the rapidly expanding market for advanced packaging and AI-driven hardware. This move aligns with the company’s broader transition away from legacy LCD materials toward high-margin semiconductor components. As the industry shifts from front-end miniaturization to complex 3D stacking and heterogeneous integration, Sumitomo Chemical is positioning its expertise in high-purity chemicals and photoresists to meet the specific demands of next-generation back-end processes.
To support this shift, Sumitomo Chemical recently announced a ¥100 billion investment to upgrade facilities at its Osaka factory, with new production lines for advanced photoresists expected to come online by the first half of 2026. These investments are part of a long-term roadmap to reach ¥100 billion in core operating profit within its ICT and mobile solutions sector by 2030. Further strengthening its position in the AI supply chain, the company formed a joint venture with Samsung Electro-Mechanics in late 2025 to mass-produce glass substrates, targeting commercial rollout by 2027 for high-performance computing applications.
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