Amkor is increasing its investment in a new Arizona advanced packaging facility to $7 billion to support Nvidia and Apple's domestic supply chain requirements. The plant is expected to finish construction in mid-2027 and begin mass production in 2028, providing oS packaging for Nvidia's CoWoS and FCBGA for Apple's M-series chips. Additionally, Amkor has reportedly partnered with Intel to produce EMIB 2.5D packaging at its Songdo facility in South Korea.