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Meta and Google seek advanced packaging capacity from Powertech and Ardentec amid TSMC shortages

Friday, December 26, 2025 at 12:15 AM

Major cloud companies are diversifying their advanced packaging supply chains beyond TSMC due to ongoing capacity constraints. Meta has reportedly awarded exclusive packaging and testing contracts to Powertech, leading to full utilization of its production lines. Ardentec is also gaining traction as a potential partner for AI chip testing as Google and others seek alternatives for their latest silicon.

Context

Meta and Google are diversifying their AI chip supply chains by securing advanced packaging capacity from Powertech Technology and Ardentec due to ongoing shortages at TSMC. While TSMC remains the primary foundry for AI silicon, its CoWoS capacity is heavily constrained by massive demand from NVIDIA. To secure their hardware roadmaps for 2025, these US cloud giants are leveraging Powertech’s specialized memory packaging expertise to assemble custom AI accelerators and high-bandwidth hardware. Powertech has reportedly won exclusive packaging and testing contracts from Meta, pushing its current production lines to full capacity. Meanwhile, Ardentec is seeing increased interest from Google as a critical testing partner. This strategic shift highlights a growing trend of hyperscalers moving back-end processes away from TSMC to accelerate time-to-market for proprietary silicon, directly benefiting secondary Taiwanese semiconductor assembly and testing providers.

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