HBF (High Bandwidth Flash), a NAND-based memory similar to HBM but offering higher capacity, is expected to accelerate commercialization and be integrated into Nvidia, AMD, and Google products by late 2027 or early 2028. This rapid development is due to HBM's capacity limitations for AI data and the leverage of existing HBM process and design technologies by manufacturers like Samsung Electronics and SK Hynix. SanDisk is also involved in standardization efforts. HBF is projected to achieve over 1,638 GB/s bandwidth and 512GB capacity, significantly exceeding standard SSDs and HBM4, respectively. SK Hynix plans to release a trial version for demonstrations soon. HBF is envisioned to work alongside HBM in AI accelerators, handling 'KV Cache' for AI inference, with a potential to surpass the HBM market by 2038.