Rumor
Samsung specialized HBM4 might not appear at CES 2026
Thursday, January 8, 2026 at 11:38 AM
A report suggests that Samsung's specialized high bandwidth memory (SPHBM4) may not be featured at the CES 2026 event, indicating potential shifts in the commercialization timeline for next-generation AI memory technology.
Context
Samsung is reportedly opting out of showcasing its specialized HBM4 (High Bandwidth Memory 4) technology at CES 2026, a move that contrasts with rival SK Hynix, which used the event to unveil its 16-high 48GB modules. Analysts suggest Samsung is prioritizing professional technical venues, with plans to debut an upgraded version of the chip at the ISSCC in February 2026. This "specialized" iteration reportedly features a redesigned interface capable of achieving 3.3 TB/s bandwidth, a 37.5% increase over earlier prototypes.
The absence at CES signifies a shift in strategy toward "turnkey" custom solutions that integrate Samsung’s in-house 4nm logic dies with its latest 1c-class DRAM. Mass production remains targeted for February 2026 at the Pyeongtaek campus to meet demand for Nvidia’s upcoming Rubin platform. Additionally, Samsung is following the newly finalized JEDEC SPHBM4 (Standard Package HBM4) spec, which uses a reduced 512-pin count to lower packaging costs while maintaining high-end AI performance for hyperscale data centers.
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