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AWS's Next-Generation AI Chip Reportedly Adopt TSMC's 2nm Process
Tuesday, December 2, 2025 at 08:38 PM
Reports indicate that Amazon Web Services (AWS) will utilize Taiwan Semiconductor Manufacturing Company's (TSMC) 2nm process technology for the production of its next-generation artificial intelligence chip. This follows the industry trend of major hyperscalers securing capacity for custom AI ASICs on the most advanced process nodes.
Context
At AWS re:Invent 2025, Amazon Web Services unveiled its new Trainium3 AI chip, built on a 3nm process. These Trainium3 UltraServers boast up to 144 chips per server, delivering roughly 4x the performance and 40% better energy efficiency compared to the previous generation. This significant upgrade underscores AWS's commitment to advancing its custom silicon for AI workloads, directly competing with other major chip developers. The move is critical for meeting the escalating demand for high-performance, energy-efficient AI infrastructure.
Looking ahead, AWS has also outlined plans for Trainium4, which is expected to incorporate Nvidia's NVLink Fusion interconnect technology. While not officially confirmed by AWS or TSMC, reports from Taiwan's Commercial Times, via NNA and Yahoo Japan, suggest that TSMC will fabricate Trainium4 using its advanced 2-nanometer process. This next-generation chip is anticipated to ship around end-2027, with Alchip reportedly handling the design. This potential collaboration with TSMC on a cutting-edge process node highlights the intense competition and rapid innovation in the AI chip market, with implications for future cloud computing capabilities and semiconductor supply chains.
Sources (16)
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