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Samsung Electronics evaluates SEMES and Besi hybrid bonding equipment for advanced packaging
Tuesday, March 31, 2026 at 10:33 AM
Samsung Electronics has integrated Besi hybrid bonding equipment for development and is currently conducting quality evaluations on a competing tool from SEMES. While testing both, reports indicate the SEMES hybrid bonder is currently less technologically mature than the Besi alternative, potentially leading to higher-than-anticipated order volumes for Besi equipment.
Context
As of March 31, 2026, Samsung Electronics has intensified its evaluation of hybrid bonding equipment, a critical technology for next-generation HBM4E memory featuring 16 or more layers. While Samsung has been quality-testing a hybrid bonder from its subsidiary SEMES, reports indicate the tool is currently less mature than competing solutions. Consequently, Samsung has already introduced equipment from Besi (BE Semiconductor Industries) for development purposes, signaling a potential shift toward higher-than-expected procurement from the Dutch supplier to meet aggressive production timelines.
This development is pivotal as the industry transitions from traditional thermal compression bonding to hybrid copper-to-copper bonding to reduce stack height and heat resistance by over 20%. With rivals like SK Hynix recently placing mass-production orders for the Applied Materials-Besi joint Kinex system, Samsung faces immense pressure to finalize its supply chain. If SEMES fails to reach maturity quickly, Besi is positioned to capture a dominant share of Samsung’s advanced packaging lines for the NVIDIA Vera Rubin and AMD Instinct MI455X platforms.
Sources (9)
Samsung Unveils HBM4E, Showcasing Comprehensive AI Solutions, NVIDIA Partnership and Vision at NVIDIA GTC 2026 – Samsung Global NewsroomSamsung accelerates HBM hybrid bonding line to meet Nvidia demandSamsung, Hanwha set sights on hybrid bonding - KED GlobalHBM4 Sticks With Microbumps, Postponing Hybrid BondingHybrid Bonding Showdown-Electronics Headlines-EEWORLDWith Kinex, Applied and Besi provide a glimpse into their hybrid bonding technology - Bits&ChipsSamsung Electronics Adopts Hybrid Bonding Inspection Equipment - THE ELEC, Korea Electronics Industry MediaBesi & Hybrid Bonding’s Path to Scale: From Yield Bottlenecks to 2026–2030 Adoption | BESI | BE Semiconductor Industries | Interview | In Practise
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