TSMC prioritizes AI chip orders as 3nm capacity constraints drive designers toward Samsung
Rumor

TSMC prioritizes AI chip orders as 3nm capacity constraints drive designers toward Samsung

Monday, March 23, 2026 at 02:44 AM

TSMC is currently facing severe capacity constraints for its 3nm and other advanced process nodes due to a surge in demand. The foundry is reportedly prioritizing AI-related orders from major clients like Nvidia, AMD, Broadcom, and Marvell, followed by long-term partners such as Apple and MediaTek. This backlog is prompting some chip designers to consider shifting production to Samsung Foundry, while others are signing long-term agreements to secure future capacity.

Context

The global semiconductor supply chain is facing a structural shift as Nvidia has reportedly overtaken Apple as TSMC's largest revenue contributor in 2025, accounting for approximately 19% of total sales. This surge in AI demand has pushed TSMC's 3nm capacity to its limits, leading the foundry to prioritize high-margin AI orders from Nvidia, AMD, Broadcom, and Marvell. Consequently, long-term partners like Apple and MediaTek are seeing their traditional "priority shipping" status challenged, with some firms now mulling a move to Samsung Foundry to secure advanced node capacity. To manage this overwhelming demand, TSMC is projected to increase its 2026 capital expenditure to a record $52-56 billion, focusing heavily on expanding both advanced logic processes and CoWoS packaging. As 3nm remains fully booked and 2nm tape-outs are already tracking at 1.5x the rate of the previous generation, chip designers are increasingly forced into signing restrictive long-term agreements. This capacity crunch signals a potential opening for Samsung, despite its reported 50% yield gap compared to TSMC's 90% at the 3nm node.

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