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Adeka develops polymer resins for hybrid bonding in collaboration with Yokohama National University
Thursday, February 26, 2026 at 08:09 AM
ADEKA is collaborating with Yokohama National University to develop polymer resins specifically designed for hybrid bonding processes in semiconductor packaging.
Context
Adeka has partnered with Yokohama National University to develop advanced polymer resins specifically designed for hybrid bonding, a critical process in next-generation semiconductor packaging. This collaboration aims to refine materials that facilitate the direct connection of chips without traditional solder bumps, significantly increasing interconnect density. By leveraging polymer-based solutions rather than traditional inorganic dielectrics, Adeka targets a more cost-effective and flexible manufacturing path for high-performance processors.
This development is vital as the industry shifts toward 3D integration to meet the demands of AI and high-performance computing. Hybrid bonding is currently a bottleneck in the supply chain, and Adeka’s entry into this space positions it to capture share in a market where interconnect density is expected to scale by 10x or more over the next few years. As major players like TSMC and Intel accelerate their advanced packaging roadmaps, Adeka’s focus on polymer resins offers a potential solution for lowering bonding temperatures and improving yield.
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