Rumor
Google and MediaTek chips integrated in v9ax package with separate memory IO die
Tuesday, February 10, 2026 at 05:24 PM
The v9ax integrates a Google-developed die and a MediaTek die within the same package, with memory IO on a separate die. The user expresses concern that using a dedicated memory IO die is inefficient compared to integrating logic and caching into HBM4E base dies, as it could negatively impact latency and IO speed.
Context
Ibiden is set to enter Google’s TPU substrate supply chain as the search giant diversifies its AI infrastructure to reduce reliance on Broadcom. This shift is driven by MediaTek’s aggressive pricing, with its ASIC service fees reportedly less than half those of Broadcom. While Google remains satisfied with MediaTek’s 224G SerDes IP quality, it does not yet fully match Broadcom’s industry-leading performance. This dual-sourcing strategy allows Google to optimize costs while scaling production for its upcoming TPU v7e and v8 chips, which are expected to ramp up through 2026.
A major architectural pivot is also emerging for the next-generation TPU v9AX, as Broadcom considers adopting Intel’s EMIB advanced packaging over TSMC’s CoWoS. This move positions Ibiden—a long-standing Intel partner—as a primary substrate supplier for Google’s high-performance AI silicon. Furthermore, Google is reportedly planning to skip HBM4 entirely, transitioning directly to HBM4E memory to meet the bandwidth demands of the 2027 roadmap. These shifts signal a strengthening of the Intel-Ibiden ecosystem within the Tier-1 AI supply chain.
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