Rumor
Apple to transition M5 Pro and M5 Max chips to 2.5D advanced packaging
Wednesday, February 4, 2026 at 01:50 PM
Apple is expected to transition its high-performance M5 Pro and M5 Max chips from Integrated Fan-Out (InFO) packaging to 2.5D advanced packaging technology. This shift is intended to improve thermal management and reduce electrical resistance for next-generation silicon.
Context
Apple is transitioning its upcoming M5 Pro and M5 Max processors to 2.5D advanced packaging, marking a significant architectural shift from the InFO technology used in previous generations. By utilizing TSMC’s sophisticated SoIC-mH (System-on-Integrated-Chips) process, Apple will decouple the CPU and GPU onto separate dies. This "server-grade" approach is designed to drastically improve heat dissipation and reduce electrical resistance, addressing the thermal bottlenecks common in high-performance professional hardware.
For investors, this move underscores Apple’s strategic pivot toward "Private Cloud Compute" and the intensifying hardware requirements of Apple Intelligence. Transitioning to 2.5D packaging—a method typically reserved for high-end AI accelerators—suggests a focus on yield optimization and performance-per-watt as the company migrates to the 3nm N3P fabrication node. Following mass production in late 2025, the first updated MacBook Pro models featuring these chips are expected to debut in March 2026, reinforcing Apple's lead in the high-end silicon supply chain.
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