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Nikon showcases high-precision image measurement system for 1.5 micrometer patterns at SEMICON Japan
Thursday, December 25, 2025 at 10:40 AM
At SEMICON Japan 2025, Nikon demonstrated an image measurement system capable of high-precision batch measurement for line-and-space patterns as small as 1.5 micrometers.
Context
Nikon is aggressively expanding its footprint in the semiconductor back-end process, showcasing its advanced NEXIV video measuring system at SEMICON Japan. The system is designed to provide high-precision batch measurement for ultra-fine 1.5 micrometer (µm) line-and-space patterns, a critical requirement for the next generation of AI-driven integrated circuits. This technology addresses the growing complexity of advanced packaging and chiplet designs, where increasing package sizes and shrinking wiring patterns demand superior metrology tools.
The latest NEXIV VMF-K series highlights a significant leap in productivity, offering 1.5 times the measurement throughput of previous models. By integrating a confocal optical system, the platform allows for simultaneous 2D and height measurements, reducing inspection times for glass substrates and advanced substrates used in data center ICs. This performance boost is essential as manufacturers scale production of high-performance computing (HPC) components that require rigorous quality assurance at the micron level.
This move aligns with Nikon’s strategic pivot toward the semiconductor supply chain's high-growth segments, specifically focusing on advanced packaging and back-end lithography. With the recent introduction of the DSP-100 digital lithography system, which targets 1.0 µm resolution, the NEXIV measuring systems complete a specialized ecosystem for panel-level packaging. As AI demand continues to drive the industry toward larger, more densely packed semiconductors, Nikon is positioning itself as a vital provider of the precision measurement infrastructure necessary for these advanced architectures.
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