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SCREEN Semiconductor Solutions Launches New Exposure Equipment Model
Tuesday, December 9, 2025 at 08:36 PM
SCREEN Semiconductor Solutions has introduced a new model of exposure equipment featuring a resolution of 1µm or less, as reported by a news outlet.
Context
SCREEN Semiconductor Solutions (SCREEN SPE) has launched its new direct-imaging/maskless exposure system, the DW-3100, with sales commencing in December 2025. This advanced equipment is specifically designed for cutting-edge semiconductor packaging, achieving a world-class resolution of sub-1 µm. It leverages a proprietary MEMS/GLV-based light modulator and redesigned optics to deliver this precision, addressing the growing demands of high-performance computing and AI packaging.
The DW-3100 supports both 200/300 mm wafers and 300/310 mm square panels, making it versatile for various advanced packaging applications. The system also incorporates image-correction technology to compensate for wafer warpage and can pattern unique IDs for traceability, enhancing manufacturing efficiency and quality control.
SCREEN Semiconductor Solutions plans to sell 2+ units in FY2026 and aims to capture over 50% market share in the maskless packaging exposure segment in the mid to long term. This product is strategically important as it significantly expands the company's addressable market in packaging, positioning it as a potential high-leverage growth driver amid increasing demand for heterogeneous AI packaging.
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