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UMC and Polar Semiconductor Sign MOU to Collaborate on U.S. 8-inch Wafer Production

Friday, December 5, 2025 at 01:55 PM

United Microelectronics Corporation (UMC) and Polar Semiconductor have signed a Memorandum of Understanding (MOU) to explore collaboration on scalable 8-inch wafer production at Polar's recently expanded facility in Minnesota, aiming to meet growing demand for U.S. onshore semiconductor manufacturing.

Context

UMC and Polar Semiconductor signed a Memorandum of Understanding on December 4, 2025, to explore collaboration for U.S.-based 8-inch wafer production. This strategic partnership aims to bolster domestic semiconductor manufacturing, addressing the increasing demand for "made-in-USA" chips across critical sectors such as automotive, data centers, consumer electronics, and aerospace & defense. The initiative leverages Polar Semiconductor's recently expanded 8-inch facility in Minnesota and its specialized manufacturing capabilities, combined with UMC's extensive 8-inch technology portfolio and global customer network. This collaboration is significant for enhancing supply chain resilience amidst geopolitical shifts and supporting customers' multi-sourcing strategies. Polar Semiconductor is actively expanding its capacity, aiming to double its monthly sensor and power-chip output from 20,000 to 40,000 wafers within the next one to two years, backed by over US$100 million in CHIPS Act funding. The partnership will identify specific devices for production at Polar's Minnesota facility, reinforcing the U.S. onshore semiconductor ecosystem.

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