Rumor
TSMC reportedly asked to accelerate conversion of CoWoS-S capacity to CoWoS-L
Thursday, March 5, 2026 at 12:58 PM
Recent reports suggest that TSMC has been instructed to accelerate the conversion of its existing CoWoS-S advanced packaging capacity into CoWoS-L capacity to meet changing demand for AI chip architectures.
Context
Recent supply chain reports indicate that Nvidia has requested TSMC to accelerate the conversion of its CoWoS-S (Silicon interposer) capacity to the more advanced CoWoS-L (Local Silicon Interconnect) standard. This shift is driven by the production ramp of Nvidia’s Blackwell architecture, which primarily utilizes CoWoS-L to enable higher interconnect density and larger package sizes. While the previous-generation Hopper GPUs utilized CoWoS-S, demand for that legacy capacity is beginning to decline as the product lifecycle matures.
This transition is a critical indicator of the AI supply chain's evolution toward more complex, multi-die integration. TSMC has projected its total CoWoS monthly output to reach 75,000 wafers by 2025, yet advanced packaging remains the primary bottleneck for global AI hardware availability. By repurposing older lines for CoWoS-L, TSMC aims to maximize utilization and support the mass production of next-generation chips like the GB300 and Rubin series, which are expected to enter the market between late 2025 and early 2026.
Sources (7)
TSMC 2024 Annual Report Website - Investors - Taiwan Semiconductor ManufacturingTSMC's CoWoS is rumored to have its orders cut again-Electronics Headlines-EEWORLDNvidia transitions to advanced CoWoS-L chip packaging, signaling a major shift for TSMC | TechSpotNvidia shifts to CoWoS-L packaging for Blackwell GPU production ramp-up | Tom's HardwareCoWoS-S, R, L Explained – TSMC’s Advanced Packaging Strategies for AI & HPCCoWoS Advanced Compute Packaging Crisis Explained: The Single Biggest Constraint on Global AI Supply Chain GrowthWhat Are CoWoS-S, CoWoS-R, and CoWoS-L? - 7evenguy finance blog
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