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Epson partners with Rapidus to apply printing technology to semiconductor manufacturing
Tuesday, March 31, 2026 at 08:52 PM
Epson is collaborating with Rapidus to apply its industrial inkjet printing technology to semiconductor manufacturing processes. This partnership aims to leverage precision printing for advanced chip fabrication and potentially reduce material waste in the manufacturing chain.
Context
Seiko Epson Corporation has expanded its presence in the semiconductor supply chain by partnering with Rapidus, Japan’s state-backed 2nm foundry project. This collaboration leverages Epson’s advanced PrecisionCore inkjet and MEMS printing technologies to innovate semiconductor manufacturing, specifically in the high-precision deposition of functional materials on silicon wafers. This additive manufacturing approach aims to improve material efficiency and reduce the environmental footprint compared to traditional lithography-heavy fabrication.
This move follows the 2024 establishment of Rapidus Chiplet Solutions (RCS) within Epson’s Chitose campus in Hokkaido. The 9,000-square-meter cleanroom facility is a critical hub for back-end R&D, focusing on advanced packaging techniques like hybrid bonding and 2.5D/3D chiplet integration. As of March 2026, equipment installation is underway, with full R&D operations scheduled to begin in April 2026.
For investors, the partnership underscores Epson’s strategic pivot toward the semiconductor equipment and materials market. By aligning with Rapidus, which aims for mass production of 2nm logic chips by 2027, Epson secures a primary role in Japan's national effort to regain leadership in the global AI chip supply chain alongside partners like IBM and Siemens.
Sources (11)
Rapidus establishes state-of-the-art back-end semiconductor manufacturing process research-and-development centerRapidus Chiplet Solutions, a new R&D facility and clean room, will be located on Seiko Epson’s Chitose campus - Information - Rapidus CorporationRapidus plans to send 2nm chips to Broadcom in June, says report ...Rapidus establishes state-of-the-art back-end semiconductor manufacturing process research-and-development centerRapidus, Siemens Join 2-nm Alliance Targeting 2027 Production - EE Times[PDF] 令和7年度「産業団地におけるGXの実践的手法調査事業」報告書 Semiconductor Foundry Service Market Outlook 2026-2032Japan's Rapidus set to rival TSMC and Samsung for chip supremacy - Asia TimesMEMS Fabrication Technology | Technology | Epson
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