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NXP Semiconductors releases i.MX 93W chip integrating edge AI and wireless connectivity
Wednesday, March 18, 2026 at 09:40 AM
NXP Semiconductors has released the i.MX 93W series, an integrated solution that combines edge AI processing and wireless connectivity on a single chip to address industrial and IoT infrastructure needs.
Context
On March 9, 2026, NXP Semiconductors announced the launch of the i.MX 93W, the industry's first applications processor to integrate a dedicated AI neural processing unit with secure tri-radio wireless connectivity. This new System-on-Chip (SoC) combines the existing i.MX 93 processor with the IW610 wireless module into a single 14.2 x 12 mm package. By consolidating compute and connectivity, the chip can replace up to 60 discrete components, significantly reducing board space, system cost, and supply chain complexity for manufacturers of physical AI devices.
The hardware features dual Arm Cortex-A55 cores and an Arm Ethos-U65 NPU delivering 1.8 eTOPs of AI performance, alongside support for Wi-Fi 6, Bluetooth 5.4, and 802.15.4 protocols like Thread and Matter. Aimed at smart buildings, industrial automation, and healthcare wearables, the platform is designed to accelerate the deployment of local AI agents. NXP expects to begin sampling the i.MX 93W to customers in the second half of 2026, supported by their eIQ AI software enablement suite.
Sources (4)
i.MX 93W Integrated Wireless Applications ProcessorNXP’s New i.MX 93W Fuses Edge Compute and Secure Wireless Connectivity to Accelerate Physical AI | NXP SemiconductorsNXP Unveils the i.MX 93W, Replacing "Up to 60 Discrete Components" in Physical AI Designs - Hackster.ioNXP Semiconductors - Edge AI and Vision Alliance
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