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MediaTek proposes EMIB solution for Meta Arke project to compete with Broadcom

Monday, February 2, 2026 at 01:38 AM

MediaTek is reportedly proposing an EMIB-based advanced packaging solution for Meta's Arke project, positioning it as a competitor to Broadcom's CoWoS-based proposal. The move highlights a shift in technical strategies for custom AI accelerators between major silicon providers.

Context

Meta is accelerating its custom silicon roadmap by partnering with Broadcom to develop the MTIA-3 AI chip, which is scheduled to debut in the second half of 2026. This next-generation accelerator will be manufactured using TSMC’s advanced 3nm process. Broadcom will act as the primary design partner for the chip’s compute and I/O components, reinforcing its position as a critical enabler for hyperscale custom silicon. The move underscores Meta’s strategy to build proprietary server systems and reduce long-term dependency on external chip vendors. The MTIA-3 features significant technical upgrades over its predecessors, including an added SoC chip and eight HBM3E 12Hi stacks per CoWoS package to handle massive generative AI workloads. Meanwhile, the current generation MTIA-2 is already in production on the TSMC 3nm node and is slated for rollout in the first half of 2026. For investors, this aggressive dual-track deployment signals Meta’s commitment to infrastructure self-sufficiency and the continued dominance of TSMC and Broadcom within the high-end AI supply chain.

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