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Goldman Sachs report details ASML EUV layer counts per technology node
Friday, March 13, 2026 at 04:56 PM
Analysis from Goldman Sachs provides a breakdown of the increasing number of EUV lithography layers required for each successive semiconductor process node, highlighting the growing intensity of ASML equipment usage in advanced chip manufacturing.
Context
A recent report from Goldman Sachs provides critical visibility into the adoption of Extreme Ultraviolet (EUV) lithography, detailing the increasing number of layers required for future semiconductor nodes. As the industry moves toward 2nm logic and advanced DRAM, ASML remains the sole provider of these machines. The investment bank’s analysis indicates that ASML could potentially double its 2030 revenue expectations as AI-driven demand for smaller, more efficient chips intensifies.
This data is particularly relevant as ASML transitions from its current 0.33 NA systems to next-generation High-NA (0.55 NA) tools. The report notes that while standard EUV is essential for 7nm, 5nm, and 3nm nodes, the new EXE:5200B systems are designed for sub-2nm production. High-NA technology reduces manufacturing complexity by allowing single-patterning for layers that previously required multiple exposures, significantly cutting costs and cycle times for lead customers like TSMC, Intel, and Samsung.
Investors are tracking these layer counts to gauge the long-term total addressable market (TAM) for lithography equipment. With ASML aiming for a capacity of 90 standard units and reaching high-volume manufacturing for High-NA by 2026–2027, the increasing density of EUV layers per wafer serves as a primary driver for the company’s valuation. Despite potential competition from pattern-shaping tools, Goldman Sachs views ASML as a unique bottleneck in the AI supply chain, underpinned by a multi-year order backlog.
Sources (11)
[PDF] THE US-CHINA TECH RACE | Goldman SachsEUV lithography systems – Products - ASMLIBM demonstrates High NA EUV process capability on track for insertion below 2 nm nodes at SPIE 2026 - IBM ResearchPress conference ASMLGoldman Sachs sees further gains to come for ASMLExclusive-ASML says next-gen EUV tools ready to mass-produce chips, marking key shift for AI chip production By ReutersEUV's Future Looks Even Brighter - Semiconductor EngineeringExtreme ultraviolet lithography - Wikipedia
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