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Hamamatsu Photonics launches high-speed 300mm wafer film thickness measurement tool
Monday, December 1, 2025 at 10:40 AM
Hamamatsu Photonics has released a new in-line film thickness measurement tool for 300mm wafers that can complete a full-surface scan in just five seconds, which is intended to improve semiconductor production efficiency.
Context
Hamamatsu Photonics has launched its new HyperGauge In-plane Film Thickness Meter, the C17319-11, a device designed to boost productivity in semiconductor manufacturing. The system can perform a full-surface measurement of a 300 mm wafer in just 5 seconds, a critical speed enhancement for quality control processes. This capability is designed to reduce process losses and improve yields for both bare and patterned wafers. Orders for the new tool began on December 1, 2025, targeting global semiconductor and equipment manufacturers.
This launch is significant as it addresses a key bottleneck in advanced chip production. By providing rapid, complete wafer maps, the tool helps fabs improve yields and reduce costly rework, particularly for complex AI logic wafers. The system uses Hamamatsu's proprietary λ-Capture® camera technology, offering high resolution and excellent measurement reproducibility. This positions the company to gain a competitive edge in the high-value metrology market as the industry pushes toward more advanced manufacturing nodes.
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