News
Yamaha Motor launches hybrid placer supporting 300mm wafer and large substrate transport
Friday, January 16, 2026 at 06:40 AM
Yamaha Motor has launched a new hybrid placer designed to handle large-scale substrates, specifically supporting 300mm wafers and larger formats used in advanced semiconductor packaging.
Context
Yamaha Motor has launched the i-Cube10 (YC10), a new hybrid placer designed to address the increasing complexity of advanced semiconductor packaging. Released in January 2026, the machine is specifically built to support 12-inch wafers and large-format substrates. This technology is critical for the production of high-performance AI chips, enabling the integration of Chiplet and CoWoS architectures by combining high-speed surface mounting with precision wafer bonding in a single system.
The i-Cube10 offers a significant performance upgrade, featuring a mounting accuracy of ±5μm and a throughput capacity of 12,000 units per hour. These specifications allow manufacturers to scale the production of large-scale AI accelerators and data center processors more efficiently. By expanding its footprint in the back-end semiconductor equipment market, Yamaha Motor is positioning itself as a key enabler of the AI infrastructure boom, targeting the high-margin demand for dense, high-speed computing hardware.
Related Companies
Yamaha
7951