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ASML develops 1000W EUV light source technology to increase throughput by 50%
Monday, February 23, 2026 at 02:46 PM
ASML has developed technology to increase EUV light source power to 1000W, which is expected to improve wafer throughput by 50% in advanced semiconductor manufacturing.
Context
ASML has unveiled a significant advancement in its extreme ultraviolet (EUV) light source technology, projecting it will increase chip production capacity by 50% by 2030. The company successfully boosted the power output of its EUV systems from 600 watts to 1,000 watts. This was achieved by doubling the rate of tin droplets to 100,000 per second and utilizing a two-pulse laser shaping technique to create more efficient plasma for chip etching.
This breakthrough allows major chipmakers like TSMC, Intel, and Samsung to increase throughput from current levels of 220 to roughly 330 wafers per hour. For investors, this ensures ASML remains the indispensable linchpin of the global AI supply chain, offering a clear path to lower per-chip costs and higher yields for next-generation sub-2nm nodes. The roadmap also suggests future potential for power levels reaching 2,000 watts, solidifying the company's competitive moat against emerging lithography startups and international rivals.
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