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SK Hynix to invest $13.3 billion in equipment for leading-edge process migration

Monday, March 9, 2026 at 03:36 AM

SK Hynix is reportedly planning to allocate approximately $13.3 billion strictly for semiconductor equipment procurement this year. This aggressive capital expenditure is aimed at accelerating the company's migration to leading-edge manufacturing processes, likely to support growing demand for high-bandwidth memory (HBM) and advanced DRAM nodes.

Context

Memory giant SK hynix is significantly accelerating its capital expenditure to maintain leadership in the AI-driven semiconductor market. The company has announced a $13.3 billion investment specifically for equipment and a new state-of-the-art packaging fab, P&T7, in Cheongju. This facility is designed to create a full-cycle production hub for High Bandwidth Memory (HBM), integrating front-end wafer fabrication with advanced back-end packaging to meet soaring demand from AI hardware providers. This investment is part of a broader strategic expansion that includes the Yongin Semiconductor Cluster, where total projected costs could eventually reach 600 trillion won. By pulling forward the launch of its first Yongin cleanroom to February 2027, SK hynix aims to stay ahead of competitors like Samsung and Micron. The move highlights a critical shift toward "memory foundry" models, utilizing next-generation EUV lithography and 10-nanometer level process migrations to secure the supply chain for HBM4 and beyond.

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