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Intel utilizes semiconductor manufacturing techniques to develop compact quantum computers

Sunday, March 22, 2026 at 11:23 PM

The article discusses how semiconductor manufacturing techniques are being applied to scale quantum computing hardware, with Intel focusing on silicon-based spin qubits that leverage existing CMOS fabrication processes to reduce the size of quantum systems.

Context

As of March 2026, Intel has achieved a critical milestone in the race for scalable quantum computing by successfully applying its high-volume 300mm CMOS manufacturing expertise to produce silicon spin qubits. By leveraging advanced Extreme Ultraviolet (EUV) lithography, Intel is fabricating quantum devices that are roughly the size of a single transistor—nearly 1 million times smaller than competing superconducting qubits. This breakthrough allows the company to produce tens of thousands of potential qubit devices on a single wafer with a yield exceeding 95%, significantly outperforming traditional laboratory-scale fabrication methods. This transition to standard semiconductor infrastructure is essential for moving quantum technology from the lab to the commercial market. Recent deployments, such as the 12-qubit Tunnel Falls processor at Argonne National Laboratory, demonstrate that these devices can achieve 99.9% gate fidelity, the highest reported for all-CMOS industrial manufacturing. By utilizing existing fabrication plants and developing cryogenic control chips like Horse Ridge II, Intel is positioning itself to overcome the massive interconnect and scaling bottlenecks that currently limit quantum systems to small, experimental arrays.

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