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Resonac led JOINT2 consortium to focus on 140mm square substrates in 2026
Wednesday, December 24, 2025 at 10:40 AM
Resonac's JOINT2 consortium is nearing its final stage at SEMICON Japan 2025, with a strategic shift to focus on 140mm square substrates in 2026 for advanced semiconductor packaging.
Context
Resonac-led consortium JOINT2 has confirmed it will shift its primary development focus to 140mm square substrates starting in 2026. This strategic pivot, detailed during SEMICON Japan, represents the final phase of the consortium's current roadmap to standardize massive semiconductor packages. By scaling up from current dimensions, the group of 13 material and equipment suppliers aims to establish the technical infrastructure necessary to support the increasingly complex architecture of next-generation artificial intelligence accelerators.
This transition to 140mm footprints is critical for investors as it addresses the physical limitations of current chiplet designs. Larger substrates allow for the integration of significantly more high-bandwidth memory (HBM) and processing tiles into a single unit, which is essential for high-performance computing. Resonac’s leadership in this initiative positions the company at the center of the AI supply chain, providing the specialized materials and equipment workflows required to manage the thermal and structural stresses of these ultra-large semiconductor packages.
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