News

Chinese manufacturers Visionox and AKM Meadville enter semiconductor glass substrate market

Sunday, January 18, 2026 at 09:57 AM

Chinese companies including Visionox, AKM Meadville, and Tongfu Microelectronics are entering the semiconductor glass substrate market to compete with established players in Korea, Taiwan, and the US. Visionox is investing in supply chains and collaborating with Korean technology firms, while AKM Meadville has established a pilot production line. This shift aims to capitalize on the performance benefits of glass substrates for AI chip packaging, with major industry players like Intel and Samsung also developing the technology.

Context

Chinese manufacturers Visionox, AKM Meadville, and Tongfu Microelectronics are aggressively entering the semiconductor glass substrate market, joining BOE in a strategic pivot from display and PCB sectors. Visionox is launching full-scale investment this year, leveraging display expertise to challenge established leaders like Intel, Samsung Electro-Mechanics, and SKC. This expansion targets the booming demand for AI-specific packaging, where glass is replacing traditional plastic to enhance chip performance and thermal management. The move introduces fierce competition into a sector where AMD, Broadcom, Samsung Electronics, and Amazon are seeking next-generation solutions. AKM Meadville, currently the world’s 8th largest HDI PCB manufacturer, has already deployed pilot production lines to accelerate market entry. By integrating entire supply chains simultaneously, Chinese firms aim to leverage scale and price competitiveness to disrupt the dominance of TSMC, Unimicron, DNP, and LG Innotek in the high-performance computing space.