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Denso and MediaTek to mass produce autonomous driving SoCs by 2029
Friday, December 26, 2025 at 09:52 AM
Denso and MediaTek have announced a partnership to develop system-on-chips (SoC) for mass-market vehicles. The collaboration aims to begin mass production in 2029, focusing on end-to-end (E2E) autonomous driving technology.
Context
Japan’s largest auto parts supplier Denso has partnered with MediaTek to co-develop custom high-performance semiconductors for next-generation cockpit and ADAS systems. This collaboration leverages Denso’s deep automotive system architecture expertise and MediaTek’s advanced System-on-Chip (SoC) design capabilities. By shifting toward custom silicon, Denso aims to secure a competitive edge in the Software-Defined Vehicle (SDV) market, reducing reliance on off-the-shelf solutions while optimizing power and performance for specific vehicle platforms.
TSMC is expected to serve as the primary foundry partner, likely utilizing advanced 3nm or 5nm process nodes to meet the rigorous thermal and safety requirements of automotive hardware. This move signals a significant challenge to incumbents like Qualcomm and Nvidia as the automotive semiconductor sector is projected to reach over $100 billion by 2030. Development is currently underway, with the partnership targeting commercial deployment in vehicle models rolling out later this decade as global automakers shift toward centralized, high-compute electronic architectures.
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TSMC
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MediaTek
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Denso
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