News
Soitec advances 300mm RF-SOI, POI, and FD-SOI technology capacity
Saturday, March 7, 2026 at 10:43 PM
Soitec is focusing on the production and scaling of 300mm RF-SOI, POI, and FD-SOI technologies to meet the growing demand in semiconductor manufacturing for RF and low-power applications.
Context
French semiconductor material leader Soitec is aggressively expanding its manufacturing capacity for 300mm engineered wafers, specifically targeting the high-growth RF-SOI, POI, and FD-SOI segments. A central pillar of this strategy is the €400 million extension of its Pasir Ris facility in Singapore, which is scheduled for completion in 2024. This expansion aims to double the site's annual production to approximately two million 300mm SOI wafers to meet surging demand from the 5G smartphone, automotive, and Edge AI markets.
This capacity increase is part of a broader €1.1 billion five-year capital expenditure program intended to reach a global annual capacity of 4.5 million wafers by fiscal year 2026. Soitec expects its total addressable market to grow by 15% annually through 2030, significantly outperforming the broader semiconductor industry. By scaling its 300mm offerings, the company provides foundries and fabless customers with the manufacturing flexibility and performance uniformity required for next-generation mobile communications and low-power AI accelerators.
Sources (6)
[PDF] November 20, 2025 - SoitecEE Times Europe - Soitec to Build SOI Wafer Fab Extension in SingaporeSoitec kickstarts expansion of its Singapore wafer fab - EvertiqIBS: Edge AI and FD-SOI offer China opportunities to overtake competitors-EEWORLDFrench semiconductor firm Soitec to double production and manpower in Singapore | Singapore EDBOptimized tourist point-of-interest recommendation through ARIMA ...
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