Samsung enters backend design phase for custom HBM4E and updates memory roadmap

Samsung Electronics has progressed to the backend design phase for its 7th-generation HBM4E custom base die, involving physical circuit placement and EDA tool optimization. The company has updated its internal roadmap to accelerate mass production timelines for HBM4E (targeted for 2027) and HBM5 (targeted for 2029). Samsung has reportedly expanded its custom HBM design teams, assigning dedicated personnel for clients including NVIDIA, Google, and Meta. Competitors SK Hynix and Micron are reported to be at similar development stages for HBM4E, with the industry shifting toward integrating logic functions directly into the memory base die.