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Samsung Electronics to invest approximately 12 trillion yen this year to secure AI semiconductor leadership

Thursday, March 19, 2026 at 11:23 PM

Samsung Electronics plans to invest approximately 120 trillion won (about 12 trillion yen) this year to bolster its position in the AI semiconductor market. The massive capital expenditure is focused on securing leadership in advanced chip manufacturing and high-performance memory to meet growing AI demand.

Context

On March 19, 2026, Samsung Electronics announced a record-breaking investment of 110 trillion won (approximately $73.3 billion or 12 trillion yen) for the 2026 fiscal year. This represents a 21.7% increase over the previous year and marks the first time the company's annual capital expenditure and R&D budget has exceeded the 100 trillion won threshold. The strategic pivot is designed to reclaim the lead in the high-bandwidth memory (HBM) market from rivals like SK Hynix and to secure the supply chain for next-generation AI infrastructure. The investment will primarily support the Device Solutions division, focusing on the mass production of HBM4 chips using advanced 1c DRAM nodes and 4nm logic processes. To stabilize its market position, Samsung is shifting from traditional short-term deals to three-to-five-year supply contracts with major customers including Nvidia, AMD, and Tesla. This aggressive expansion includes efficiency upgrades at the Pyeongtaek P4 plant and the installation of key equipment at the upcoming P5 production line to meet the requirements of the ongoing AI supercycle.

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Samsung Electronics
Samsung Electronics
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