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Star Technology expands advanced packaging and silicon photonics capacity for AI supply chain

Thursday, February 5, 2026 at 03:30 AM

Star Technology (3265.TW) is expanding its role in the AI supply chain through advanced packaging and silicon photonics. The company is currently providing wafer bumping and testing services for major clients including MediaTek, AMD, and Broadcom. As TSMC faces capacity constraints for advanced packaging, outsourcing orders for wafer testing and bumping are increasing. Star Technology is also developing CPO solutions for 800G and 1.6T standards, with new production lines expected to be completed in 2026. Analysts suggest the company may enter the supply chain for Nvidia's Rubin architecture.

Context

Star Technologies (3265) is aggressively expanding its advanced packaging and silicon photonics capacity to capitalize on the surging demand for AI and high-performance computing. As TSMC continues to face capacity constraints for its leading-edge processes, overflow orders for wafer bumping and testing are increasingly shifting to specialized partners. Star Technologies reported a record 2025 revenue of NT$4.648 billion, with analysts projecting even higher growth in 2026 as the company deepens its role in the supply chains of industry giants including MediaTek, AMD, and Broadcom. The company is currently co-developing Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) solutions, with a new production line scheduled for completion in 2026 and mass production potentially starting late this year. These technologies are essential for the transition to 800G and 1.6T optical standards in next-generation data centers. Furthermore, the firm’s expected integration into the supply chain for Nvidia’s upcoming Rubin architecture provides a significant long-term catalyst as AI chip manufacturing migrates toward 3nm and 2nm nodes.

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