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Achilles develops high-adhesion plating film technology for advanced glass substrates
Monday, December 8, 2025 at 08:40 AM
Achilles Corporation announced a new technology for forming high-adhesion plating films on through-hole glass substrates, a crucial development for advanced semiconductor packaging applications.
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Achilles announced on December 8, 2025, a groundbreaking plating-film formation technology for glass substrates featuring through-holes. This innovative method utilizes a polypyrrole conductive-polymer plating solution, enabling high adhesion through a low-temperature, ambient-pressure process. This significantly improves upon conventional techniques that typically require high heat treatments exceeding 300°C, making it highly suitable for advanced semiconductor packaging.
The technology's ability to adapt to through-holes by optimizing coating viscosity and application is a critical advancement for high-density and miniaturized next-generation semiconductors. Achilles plans to collaborate with semiconductor companies on developing fine-wiring formation and mass-production technologies. The company will showcase plating-film samples at SEMICON Japan 2025, held from December 17-19, 2025, further highlighting its commitment to this crucial area, building on its 2024 high-density glass plating development.
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