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Towa to expand sales network in India with two new locations
Friday, January 30, 2026 at 11:18 AM
Japanese semiconductor equipment manufacturer TOWA is expanding its presence in India by establishing two new sales and service bases to capture growing demand for chip packaging and assembly services.
Context
Towa Corporation is aggressively expanding its footprint in India by establishing two new sales offices in Ahmedabad and Bengaluru, scheduled to open in February and March 2026, respectively. These locations will complement the company’s existing subsidiary in Gurugram, which was established in April 2025. This move aims to provide localized technical support as India’s semiconductor manufacturing ecosystem accelerates under national government initiatives and increasing foreign direct investment.
The expansion is strategically significant as Towa Corporation currently commands a 66% global market share in semiconductor molding equipment and is the sole provider of compression molding technology for High-Bandwidth Memory (HBM) used in AI applications. By strengthening its local service network, the company positions itself to capture growing demand for backend assembly and packaging equipment. While the immediate financial impact on the fiscal year ending March 2026 is expected to be slight, the expansion is a key step toward achieving the company’s long-term goal of 100 billion yen in annual sales by 2032.
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